使用法
optical alignment bga rework station for laptop,game console repair
PCB size
Max. 410x370mm Min.65x65mm
Inner Control Structure
Touch screen software + PLC+heating plate
Size of buttom heater
360*240mm
BGA Chip Size
Max.80*80mm / Min 2*2 mm
Operation interface
touch screen (MCGS)
Temperature control
K-type thermcouple
External temperature sensor
three
Machine dimension
640x630x900mm